K4H510838D

Manufacturer Part NumberK4H510838D
DescriptionDDR SDRAM Product Guide
ManufacturerSAMSUNG [Samsung semiconductor]
K4H510838D datasheet
 
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General Information
DDR SDRAM
DDR SDRAM Product Guide
December 2007
Memory Division
December 2007

K4H510838D Summary of contents

  • Page 1

    ... General Information DDR SDRAM Product Guide December 2007 Memory Division DDR SDRAM December 2007 ...

  • Page 2

    ... General Information A. DDR SDRAM Component Ordering Information SAMSUNG Memory DRAM Product Density & Refresh Organization 1. SAMSUNG Memory : K 2. DRAM : 4 3. Product H : DDR SDRAM 4. Density & Refresh 28 : 128Mb, 4K/64ms 56 : 256Mb, 8K/64ms 51 : 512Mb, 8K/64ms 1G: ...

  • Page 3

    ... K4H641638N K4H560438H 256Mb H-die 4Banks K4H560838H K4H561638H K4H560438J 256Mb J-die 4Banks K4H560838J K4H561638J K4H510438D 512Mb D-die 4Banks K4H510838D K4H511638D Note TSOP II (Lead-free sTSOP II (Lead-free FBGA (Lead-free TSOP II (Lead-free & Halogen-free FBGA (Lead-free & Halogen-free FBGA for 64Mb DDR (Lead-free & Halogen-free sTSOP II (Lead-free & ...

  • Page 4

    ... General Information C. Industrial temp DDR SDRAM Component Product Guide Density Bank Part Number 256Mb H-die 4Banks K4H561638J 256Mb J-die 4Banks K4H561638J K4H510838D 512Mb D-die 4Banks K4H511638D Note TSOP II (Lead-free sTSOP II (Lead-free FBGA (Lead-free TSOP II (Lead-free & Halogen-free FBGA (Lead-free & Halogen-free FBGA for 64Mb DDR (Lead-free & ...

  • Page 5

    ... General Information D. DDR SDRAM Module Ordering Information Memory Module DIMM Configuration Data bits Feature Depth Refresh Banks in Comp. & Interface 1. Memory Module : M 2. DIMM Configuration 3 : DIMM 4 : SODIMM 3. Data Bits 68 : x64 184pin Unbuffered DIMM ...

  • Page 6

    ... General Information E. DDR SDRAM Module Product Guide Den- Org. Part Number Speed sity M368L3223HUS CCC/CB3 32Mx 64 256MB M368L3223JUS CCC/CB3 M368L6423HUN CCC/CB3 M368L6423JUN CCC/CB3 64Mx 64 512MB *2 CCC/CB3 M368L6523DUS *2 128Mx 64 1GB CCC/CB3 M368L2923DUN M312L6420HUS CB0 M312L6420JUS CB0 64Mx 72 512MB *2 CCC/CB3 M312L6523DZ3 *2 CB0 M312L2920DUS ...

  • Page 7

    ... General Information F. Package Dimension #66 #1 (1.50) 0.65TYP (0.71) [0.65 0.08] ± NOTE REFERENCE ASS’Y OUT QUALITY #34 #33 22.22 0.10 ± (10°) (10°) 0.30 ± 0.08 66Pin TSOP(II) Package Dimension DDR SDRAM +0.075 0.125 - 0.035 0.10 MAX [ [ 0.075 MAX December 2007 Unit : mm 0.25TYP (0° ∼ 8°) ...

  • Page 8

    ... 6.40 0. (Datum (Datum 0.35 ± 0. ∅ 0.45 SOLDER BALL (Post Reflow 0.50 ± 0.05) 1.10 ± 0.10 ∅0. DDR SDRAM Units : Millimeters 8.00 ± 0.10 A #A1 MARK 1. BOTTOM VIEW Units : Millimeters 8.00 ± 0.10 A #A1 MARK 1. ...

  • Page 9

    ... General Information 60Ball FBGA (For 512Mb) 10.00 ± 0.10 #A1 Top view 10.00 ± 0.10 0. 6.40 (Datum A) 1.60 0.80 (Datum 1.20 MAX (0.90) (1.80) 4-CORNER MARK(option) 60-∅0.45 ± 0.05 0. Bottom view DDR SDRAM A #A1 MARK(option) 3.20 B (0.90) WINDOW MOLD AREA December 2007 ...

  • Page 10

    ... General Information For further information, semiconductor@samsung.com DDR SDRAM December 2007 ...