| Manufacturer |
Product - Description |
| Aavid Thermalloy |
Heat Sinks for LEDs |
| Aavid Thermalloy |
How to Select a Heat Sink |
| Aavid Thermalloy |
Thermal Adhesives |
| Aavid Thermalloy |
Thermal Greases |
| AP Technologies Ltd. |
NIR LED thermal effects |
| Avago Technologies |
Application Brief - AB I012 - Temperature compensation circuit for constant LED intensity |
| Avago Technologies |
Application Note 5316 - Thermal Management of Avago High Power Plug and Play LED Module Application |
| Avago Technologies |
White paper - signs - Thermal Modeling for Application of High Power LED |
| CeramTec AG |
CeramCool® Ceramic Heat-Sink |
| Fischer Elektronik |
Kühlkörper für LED |
| Laird technologies |
LED Thermal Management Materials |
| Laird technologies |
Thermal management solutions (gap filler materials, thermal greases…) |
| Micred |
T3ster (Thermal Transient Tester) |
| National Semiconductor |
LM26LV - 1.6V, LLP-6 Factory Preset Temperature Switch and Temperature Sensor from the PowerWise® Family |
| National Semiconductor |
LM94022Q - 1.5V, SC70, Multi-Gain Analog Temperature Sensor with Class-AB Output from the PowerWise® Family |
| National Semiconductor |
LM94023 - 1.5V, micro SMD, Dual-Gain Analog Temperature Sensor with Class AB Output from the PowerWise® Family |
| National Semiconductor |
LM95071 - SPI/MICROWIRE™ 13-Bit Plus Sign Temperature Sensor from the PowerWise® Family |
| National Semiconductor |
LM95234 - Quad Remote Diode and Local Temperature Sensor with SMBus Interface and TruTherm™ Technology from the PowerWise® Family |
| National Semiconductor |
LM95235Q - Precision Remote Diode Temperature Sensor with SMBus Interface and TruTherm™ Technology from the PowerWise® Family |
| Nichia America Corporation |
Thermal management design of LEDs |
| Nichia America Corporation |
Thermal management design of power LEDs |
| Nuventix |
SynJet Low Profile Cooler with HS |
| Nuventix |
SynJet MR-16 LED cooler with HS |
| Nuventix |
SynJet PAR-38 LED cooler with HS |
| Nuventix |
SynJet Top Mount Cooler with HS |
| Nuventix |
SynJet® for Philips Fortimo/Lexel LED Down Light Module |
| Optek Technology |
Application Bulletin 200 - Thermal behavior of GaAs LEDs |
| Optek Technology |
Thermal Management of Visible LEDs |
| OSRAM Opto Semiconductors GmbH |
Application Note - Temperature Measurement with Thermocouples |
| OSRAM Opto Semiconductors GmbH |
Application Note - Thermal consideration of LEDs in video display applications |
| OSRAM Opto Semiconductors GmbH |
Application Note - Thermal Management of Golden DRAGON LED |
| OSRAM Opto Semiconductors GmbH |
Application Note - Thermal Management of OSTAR® Projection Light Source |
| OSRAM Opto Semiconductors GmbH |
Application Note - Thermal Management of SMT LED |
| Polymer Systems Technology |
Thermally Conductive Materials |
| Stanley Electric (Co) Ltd |
Heat Dissipation Design in LEDs |
| The Bergquist Company |
Gap Filler - Selection Guide |
| The Bergquist Company |
Gap Filler 1000 (Two-Part) |
| The Bergquist Company |
Gap Filler 1100 SF (Two-Part) |
| The Bergquist Company |
Gap Filler 1500 (Two-Part) |
| The Bergquist Company |
Gap Filler 2000 (Two-Part)
Gap Filler 2000 (Two-Part) - Application note |
| The Bergquist Company |
Gap Filler 3500S35 (Two-Part) |
| The Bergquist Company |
Gap Pad 1000SF
Gap Pad 1000SF - Application Note |
| The Bergquist Company |
Gap Pad 2000SF |
| The Bergquist Company |
High Brightness LED Thermal Management Made Simple |
| The Bergquist Company |
LED Solutions Guide Shows How Bergquist Keeps Power LEDs Bright And Reliable |
| The Bergquist Company |
Liqui Bond SA 1000 (one-part) |
| The Bergquist Company |
Liqui Bond SA 2000 (one-part) |
| The Bergquist Company |
Thermal Clad - Comprehensive TClad Selector Guide |
| The Bergquist Company |
Thermal Clad Insulated Metal Substrate (IMS®) - CIRCUIT DESIGN GUIDELINES (PDF) |
| The Bergquist Company |
Thermal Clad® White Paper |
| The Bergquist Company |
Thermal Interface Compound - TIC 1000A |
| The Bergquist Company |
Thermal Interface Compound - TIC 1000G |
| The Bergquist Company |
Thermal Interface Compound - TIC 4000 |
| Thermastrate Ltd |
FLEXITHERM™ - Insulated metal substrate with low thermal resistance |
| Universal Science |
Solving problems of excessive heat in electronic assemblies |
| Vishay Intertechnology, Inc. |
Application Note - TELUX - Specification, Thermal management and design-in |
| Vossloh-Schwabe Optoelectronic |
VS-P3 - Kühlkörper und wärmeleitende Transferfolie |
| Vossloh-Schwabe Optoelectronic |
Wärmeleitende Transferklebebänder |
